Precision Optics and Optoelectronics
Solution

Molecular-Level Cleanliness System for Precision Optics &Optoelectronics, Protecting Surfaces, Coatings, and Performance from Nanoscale Contaminants in Imaging, Laser, and Sensor Systems

5/5

bupclean

One-stop industry service

15 years experience

Precision Optics and Optoelectronics Solutions

Component & Typical ContaminantCritical NeedRecommended ProductKey Rationale & Cleaning Protocol
1. High-Value Lenses & Windows
(Bare glass, AR-coated. Dust, light fingerprints)
Zero scratch risk
Maximum particle removal
BN.11040324
(Ultra-Soft)
Why: Lowest dry weight (18.7g) for supreme softness; highest inherent cleanliness.
Protocol:
1. Gross Clean: Use dry, gentle radial wipe (center out).
2. Solvent Clean: Lightly moisten with optic-grade acetone; use single, overlapping spiral wipe.
3. Dry Buff: Immediate buff with a third, dry wipe to prevent streaks.
2. Laser Optics & Crystals
(HR mirrors, Nd:YAG rods. Molecular films, dust)
Ultra-low residue (NVR)
High LIDT compatibility
No static charge
BN.11050135 (Low-Residue)
BN.11050805 (ESD-Safe)
Why: BN.11050135: Certified low extractables for LIDT.
BN.11050805: Prevents static attraction.
Protocol:
1. Static Control: Dry clean with grounded BN.11050805.
2. Solvent Rinse: Flood optic with high-purity solvent.
3. Contact Clean: Gently drag solvent-saturated BN.11050135 across surface (no rubbing).
4. Dry: Air-dry vertically in clean airflow.
3. Imaging Sensors & Fiber Endfaces
(CCD/CMOS, fiber optics. Micro-dust, oils)
Absolute zero lint
Precision form factor
ESD safety
Specialized Swabs
(BN-SWAB-100)

BN.11050805 (perimeter)
Why: Swabs offer controlled, point-contact cleaning; material is lint-free and ESD-safe.
Protocol (Fiber):
1. Inspect with scope.
2. Clean with dry swab (single-direction rotation).
3. Clean with solvent-saturated swab (IPA).
4. Final inspect.
Protocol (Sensor): Use BN.11050805 for housing; swabs only for active pixel area.
4. Assembly & Housing Interiors
(Lens barrels, housings. Dust, handling debris)
Effective particle removal
Good conformability
Cost-effectiveness
BN.11050201 (Lightweight)
or
BN.11050207 (Balanced)
Why: Excellent cleanliness at responsible cost for non-critical surfaces. BN.11050201 is softer for sensitive finishes.
Protocol:
1. Fold wipe to create clean pad.
2. Use with mild, compatible solvent.
3. Employ “rolling” motion for fresh surface contact each pass.

Company Partners

Reliable Guarantee Customer case feedback

4.9/5

Dr. Rachel Haldims

Solving a 5nm wafer defect problem

Surface charge decreased from 250V to <50V, and defect rate decreased from 12% to 1.8%.

5/5

Dr. Mariel Senry

Static electricity damage and lint can cause short circuits.

The electrostatic discharge (ESD) failure rate decreased from 8% to 0.6%, and the short circuit rate decreased from 5% to 0.3%.

4.8/5

Dr. Damian Pix

Optical equipment lens maintenance

No new scratches, charge maintained at <30V for over 8 hours, and imaging resolution improved by 15%.

4.5/5

Dr. Shi Yon

Wafer surface particulate contamination

The surface particulate contamination rate of wafers decreased by 70%, and the overall yield increased by 5%.

Microfiber cleanroom cloth

In the nanoscale world of semiconductor manufacturing, contamination control is not an option, but a necessity. Our microfiber cleanroom wipes, designed specifically for global semiconductor front-end manufacturing and precision back-end assembly, serve as a line of defense against particulate contamination, protecting sensitive circuitry and ensuring the highest product yields. Each wipe originates from our certified ISO Class 4 core production environment, manufactured and tested according to the most stringent IEST standards, and is committed to meeting the demanding requirements from mature processes to state-of-the-art packaging technologies such as 3D-ICs.

Our microfiber wipers are engineered for the most critical environments. The key is our continuous filament, 100% polyester microfiber construction which is inherently low-linting. Combined with our proprietary laser-sealing edge technology, we virtually eliminate edge shedding. Each batch is validated to release < 5 particles (>0.5µm) per square foot according to IEST-RP-CC004.3, making them ideal for photolithography, wafer inspection, and sensitive assembly areas.

Our microfiber is designed for high absorbency with low NVR (Non-Volatile Residue). The split-fiber structure creates immense surface area to trap and retain contaminants and liquids within the fabric, rather than redepositing them. When used with high-purity solvents like IPA or acetone, our wipers consistently achieve NVR levels below 10 µg/ft² in standard tests. We recommend validating with your specific solvent in a controlled test.

  • Size & Format: We can produce any roll dimensions, sheet size, or specialized die-cut shapes to fit your equipment.
  • Packaging: Options include vacuum-sealed bags, clean PE pouches, or bulk packaging for automated dispensers, all in Class 100 cleanrooms.
  • ESD Properties: We can embed permanent carbon-loaded fibers or apply topical treatments to achieve a consistent surface resistivity range from 10^6 to 10^9 ohms/sq, complete with full per-batch test data.
  • Raw Material Control: Incoming fiber certification.
  • In-process Checks: SPC (Statistical Process Control) on knitting, sewing, and cleaning.
  • Final Batch Testing: Each batch is sampled and tested for particles, NVR, and ESD in our in-house lab. We provide full Certificate of Analysis (CoA) and Compliance (CoC).
    We fully support customer audits (virtual or on-site) and provide all necessary documentation for your supplier qualification portal.