BN.11050135 Precision Electronics Low-Residue Cleanroom Wipe
A professional-grade cleanroom wipe designed specifically for high-reliability electronic cleaning processes. It delivers effective cleaning power while minimizing ionic contamination and fiber shedding, making it ideal for cleaning precision circuit boards, connectors, and electronic components sensitive to contaminants.
Product Description
The BN.11050135 is a specialized cleaning solution designed for high-reliability electronics manufacturing and assembly. Its design philosophy extends beyond basic dust removal and liquid absorption, focusing on mitigating the risks of secondary contamination introduced during the cleaning process, such as ionic residues, non-volatile residues (NVR), and microfiber shedding. It is a critical consumable for ensuring long-term product reliability and electrical stability in the final stages of the cleaning process.
| Parameter | Details |
|---|---|
| Product Code | BN.11050135 |
| Material Composition | Specialized polyester and microfiber blend (specially purified) |
| Fabric Weight | 140 GSM (±5%) |
| Standard Dry Weight | Approx. 58.0 grams (estimated based on 9-inch sample) |
| Key Cleaning Performance | Extremely Low Ionic Contamination, Low Linting |
| Typical Absorption Rate | ~170% (balanced for cleaning vs. low-residue needs) |
| Edge Treatment | Laser-cut or heat-sealed to minimize edge fiber shedding |
Core Features & Advantages
Ultimate Cleanliness & Low Contamination: The fabric undergoes specialized washing and purification processes and is rigorously tested before leaving the factory to ensure extremely low levels of critical contaminants such as chloride and sulfate ions, meeting the cleanliness standards for high-reliability electronics production.
Excellent Low-Linting Performance: Utilizes ultra-short fibers and specialized weaving technology to significantly reduce the risk of generating microfibers during wiping, especially when cleaning gold fingers, high-density connectors, and other sensitive areas.
Optimized Solvent Compatibility & Release: Offers excellent compatibility with common electronics-grade cleaning agents such as isopropyl alcohol (IPA) and deionized water, effectively delivering them to the cleaning surface while minimizing rapid evaporation or excessive residue after wiping.
Balanced Cleaning Mechanics: The 140 GSM weight provides appropriate stiffness and flexibility, enabling effective cleaning of components with leads or height variations without damaging delicate solder joints due to excessive hardness.
Traceable Quality Assurance: Production batches are traceable, and Certificates of Conformance (CoC) for key contaminant levels are available, meeting compliance and audit requirements for industries such as automotive electronics and aerospace.
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