New energy battery manufacturing
Solution
High-Purity Cleaning System for New Energy Battery Manufacturing，Precision Contamination Control for Lithium-ion, Solid-State, and Fuel Cell Production from Electrode to Assembly
5/5
bupclean
One-stop industry service
15 years experience
New Energy Battery Manufacturing Solutions
| Battery Manufacturing Stage | Critical Cleaning Need | Recommended Product | Why This Product? | Application Guidance |
|---|---|---|---|---|
| 1. Electrode Fabrication | ||||
| Mixing & Coating | Slurry splash, dust on equipment | BN.11050422 (220 GSM) | High abrasion resistance removes dried slurry; low moisture; can be used dry or with limited solvent. | Use dry or lightly dampened with deionized water for equipment surfaces. Avoid solvent near wet coating area. |
| Calendering | Metal dust (Al/Cu) from electrodes | BN.11050805 (ESD) | Conductive fibers help dissipate static that attracts dust; durable for metal debris. | Ground operator and wipe. Use in figure-8 motion on rollers. |
| Slitting & Die-Cutting | Micro burrs, cutting debris | BN.11050135 (Low Residue) | Low linting prevents new contamination; fine fiber captures micro-particles. | Use with gentle pressure to avoid embedding debris. |
| 2. Cell Assembly | ||||
| Stacking/Winding | General dust, fingerprint removal | BN.11050201 (105 GSM) | Soft, lightweight prevents damage to fragile jellyrolls/electrode stacks; cost-effective for high-volume use. | Use in dry room with minimal IPA if allowed. One-directional wipes. |
| Tab Welding | Soot, spatter from laser/welding | BN.11050312 (200 GSM) | Robust construction withstands abrasive soot; good absorption for cleaning agents. | Dampen with approved cleaner to dissolve soot before wiping. |
| Electrolyte Filling | Spills, drips, overflow | BN.11040218 (254% Abs.) | CHAMPION ABSORBER. Highest absorption rate for rapid spill control; chemically compatible. | Keep pre-positioned at filling stations. Change immediately after saturation. |
| 3. Formation & Finishing | ||||
| Formation | Electrolyte seepage, minor gassing residue | BN.11050137 (160 GSM) | Balanced durability & absorption; good for repeated cleaning of formation trays and cell surfaces. | Use with diluted mild alkaline cleaner for neutralization. |
| Degassing (Pouch) | Residual electrolyte around seal area | BN.11040324 (Ultra-Soft) | Ultra-soft, low-lint safe for cleaning sensitive sealing areas without leaving fibers. | Use with high-purity ethanol. |
| Module/Pack Assembly | General cleaning, thermal paste smears | BN.11050207 (General Purpose) | Excellent value, versatile for final external cleaning before shipping. | Standard IPA or ethanol. |
Company Partners
Reliable Guarantee Customer case feedback
4.9/5
Dr. Rachel Haldims
Solving a 5nm wafer defect problem
Surface charge decreased from 250V to <50V, and defect rate decreased from 12% to 1.8%.
5/5
Dr. Mariel Senry
Static electricity damage and lint can cause short circuits.
The electrostatic discharge (ESD) failure rate decreased from 8% to 0.6%, and the short circuit rate decreased from 5% to 0.3%.
4.8/5
Dr. Damian Pix
Optical equipment lens maintenance
No new scratches, charge maintained at <30V for over 8 hours, and imaging resolution improved by 15%.
4.5/5
Dr. Shi Yon
Wafer surface particulate contamination
The surface particulate contamination rate of wafers decreased by 70%, and the overall yield increased by 5%.
Microfiber cleanroom cloth
In the nanoscale world of semiconductor manufacturing, contamination control is not an option, but a necessity. Our microfiber cleanroom wipes, designed specifically for global semiconductor front-end manufacturing and precision back-end assembly, serve as a line of defense against particulate contamination, protecting sensitive circuitry and ensuring the highest product yields. Each wipe originates from our certified ISO Class 4 core production environment, manufactured and tested according to the most stringent IEST standards, and is committed to meeting the demanding requirements from mature processes to state-of-the-art packaging technologies such as 3D-ICs.
What makes your microfiber wipers specifically suitable for Class 1 and Class 10 cleanrooms in semiconductor fabs?
Our microfiber wipers are engineered for the most critical environments. The key is our continuous filament, 100% polyester microfiber construction which is inherently low-linting. Combined with our proprietary laser-sealing edge technology, we virtually eliminate edge shedding. Each batch is validated to release < 5 particles (>0.5µm) per square foot according to IEST-RP-CC004.3, making them ideal for photolithography, wafer inspection, and sensitive assembly areas.
We experience issues with solvent absorption and residue when cleaning precision parts. How does your product address this?
Our microfiber is designed for high absorbency with low NVR (Non-Volatile Residue). The split-fiber structure creates immense surface area to trap and retain contaminants and liquids within the fabric, rather than redepositing them. When used with high-purity solvents like IPA or acetone, our wipers consistently achieve NVR levels below 10 µg/ft² in standard tests. We recommend validating with your specific solvent in a controlled test.
Can you customize the size, packaging, and ESD properties of these microfiber wipers for our automated cleaning equipment?
- Size & Format: We can produce any roll dimensions, sheet size, or specialized die-cut shapes to fit your equipment.
- Packaging: Options include vacuum-sealed bags, clean PE pouches, or bulk packaging for automated dispensers, all in Class 100 cleanrooms.
- ESD Properties: We can embed permanent carbon-loaded fibers or apply topical treatments to achieve a consistent surface resistivity range from 10^6 to 10^9 ohms/sq, complete with full per-batch test data.
What is your quality assurance process, and can you support our audit and qualification requirements?
- Raw Material Control: Incoming fiber certification.
- In-process Checks: SPC (Statistical Process Control) on knitting, sewing, and cleaning.
- Final Batch Testing: Each batch is sampled and tested for particles, NVR, and ESD in our in-house lab. We provide full Certificate of Analysis (CoA) and Compliance (CoC).
We fully support customer audits (virtual or on-site) and provide all necessary documentation for your supplier qualification portal.