Johnathan Doe
Founder & CEO
Johnathan Doe
Marketing Head
Johnathan Doe
Finance Head
Bupclean® ESD Tape – High Temperature‑Resistant
Bupclean® ESD tape, amber polyimide. High temperature resistance up to 260°C. Surface resistance 10⁶–10⁹ Ω. For masking, soldering, and ESD protection in electronics assembly. Model BN.21011102.
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| Parameter | Value |
|---|---|
| Brand | Bupclean® |
| Model | BN.21011102 |
| Backing material | Polyimide (PI) film |
| Adhesive type | Silicone (high temperature) |
| Color | Amber / translucent amber |
| Total thickness | 0.06 mm ±0.005 mm (2.4 mils) |
| Width options | Standard: 10mm, 12mm, 15mm, 20mm, 25mm (custom on request) |
| Length per roll | 33 m (108 ft) – standard |
| Surface resistance (outer side) | 10⁶ – 10⁹ Ω (dissipative) |
| Temperature range (continuous) | –73°C to 260°C (–100°F to 500°F) |
| Temperature range (intermittent) | Up to 300°C (572°F) for short periods |
| Dielectric strength | >5000 volts |
| Adhesion to steel | 250 – 350 g/25mm |
| Tensile strength | >40 N/10mm |
| Elongation at break | >40% |
| RoHS compliant | Yes |
| Halogen free | Yes (optional, verify) |
| Shelf life (original packaging) | 12 months at 20°C, 50% RH |
Key Benefits
ESD dissipative surface
The outer surface is treated to provide controlled static dissipation. Tested per ANSI/ESD STM11.11 (point‑to‑point resistance):
| Condition | Surface resistance (Ω) | Pass/fail (10⁶–10⁹) |
|---|---|---|
| New, as received | 3.8 × 10⁷ | Pass |
| After 1 hour at 200°C | 4.2 × 10⁷ | Pass |
| After 5 hours at 260°C | 5.1 × 10⁷ | Pass |
2. High temperature resistance
The polyimide backing and silicone adhesive are formulated for extreme heat. Continuous use up to 260°C, intermittent up to 300°C. No adhesive residue after removal (properly applied and not over‑heated).
Test results after 260°C for 10 minutes:
| Property | Result |
|---|---|
| Adhesion retention | >85% of original |
| Surface resistance change | <20% |
| No adhesive transfer | Visual inspection pass |
Applications
| Industry | Typical use |
|---|---|
| PCB assembly | Gold finger masking during wave soldering, selective soldering |
| SMT rework | Masking adjacent components during hot air rework |
| Conformal coating | Protecting connectors, test points from coating overspray |
| Semiconductor | Masking leads and bond pads during high‑temperature processing |
| Electronics repair | Heat shielding during desoldering |
Customer Reviews
Our clients from semiconductor, pharmaceutical, medical device, and aerospace industries trust our cleanroom wipers for consistent performance, high absorption, and low particle generation. Here’s what they have to say.
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We have broken down the core products and actual test data into a clear, at-a-glance comparison table across six industries (semiconductor wafers, OLED panels, precision optics, biopharmaceuticals, automotive electronics, and new energy batteries). The table includes the wiper or cleanroom consumable model for each industry, key physical parameters (particle shedding, water absorbency, ionic residues, etc.), and applicable compliance standards (SEMI, GMP, IATF 16949, ISO 10993, etc.)
Industry Resources: