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Firm High Density Sponge Swab

Firm sponge cleanroom swabs with high density 100 ppi polyurethane head and ESD dissipative PP handle. Designed for removing stubborn flux adhesive and solder paste residue. Surface resistance 10⁵–10⁹ ohms. Low particle low ion semiconductor grade. Long handle for deep recess cleaning. Customizable.

We are committed to delivering five‑star service across every product we offer — from responsive support to reliable delivery and beyond. Your satisfaction is our benchmark.

Head MaterialHigh Density Polyurethane Foam (compressed)
Handle MaterialAnti static Polypropylene (ESD dissipative)
Head Width6.1mm
Head Thickness4.8mm
Head Length16.5mm
Handle Length146.5mm
Total Length163mm
Surface Resistance10⁵ – 10⁹ ohms (ESD dissipative)
Static Dissipation99 percent of 5000V in 2 seconds
Ionic ContentChloride ≤0.5 ppm
Particle Shedding≤70 particles/ml (≥0.5μm)
Absorbency≥300%
Cleanroom ClassISO Class 5 (Class 100)

Customer Reviews

Our clients from semiconductor, pharmaceutical, medical device, and aerospace industries trust our cleanroom wipers for consistent performance, high absorption, and low particle generation. Here’s what they have to say.

Father giving son a ride on shoulders, both laughing and smiling in a park setting.
Johnathan Doe

Founder & CEO

Experience the stunning spring bloom in a Paris park, featuring vibrant flowers and lush greenery.
Johnathan Doe

Marketing Head

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Johnathan Doe

Finance Head

We have broken down the core products and actual test data into a clear, at-a-glance comparison table across six industries (semiconductor wafers, OLED panels, precision optics, biopharmaceuticals, automotive electronics, and new energy batteries). The table includes the wiper or cleanroom consumable model for each industry, key physical parameters (particle shedding, water absorbency, ionic residues, etc.), and applicable compliance standards (SEMI, GMP, IATF 16949, ISO 10993, etc.)